MULTILAYER PCB MANUFACTURING

  • What is Multilayer PCB?

    Multilayer PCB refers to the circuit card that is laminated by 3 or more copper layers. With the exception of the 2 outdoor copper layers, more copper layers are sandwiched in between the protecting products. Although the manufacturing capacities of a couple of distributors are claimed beyond 40+ layers (We can rise to 40 layers), 99% of the present market need is concentrated in 4-16 layers multilayer boards.
  • Benefits of Multilayer PCBs ?

    Contrasted to 1 or 2 sided circuit boards, multilayer boards sustain denser style as well as design, saving more spacing, which remain in line with the trend of smaller sized and also smaller interaction products. Multilayer boards decrease the demand for cords, successfully shorten the range in between signal lines, sensible internal layer style can significantly minimize EMI, which fulfill the high-frequency communications.

Leading Multilayer PCB Manufacturer?

As a seasoned PCB maker, we have mastered the manufacturing innovation and also updated knowledge for the brand-new period, and are qualified to produce 4-40 layers multilayer boards. From front-line staff members to business leaders, every person maintains competitive and also passes this with the item to our clients.

MULTILAYER PCB CAPABILITIES

Items

Parameters

Material

FR4 (140Tg, 170Tg, 180Tg), FR-406, FR-408, 370HR, IT180A, Metal Core, Polyimide, Rogers

4350B/3003/4003C/5880, Taconic, Teflon, etc

Material Brands

KB, ITEQ, SY, ISOLA, Rogers (Arlon), Ventec, Laird, Nelco, Bergquist, DENKA, Panasonic,

Taconic, or other laminate on customer's request

Layer Count

1-40

Flammaility

UL 94V-0

Thermal Conductivity

0.3W-300W/mk

Quality Standards

IPC Classes 2/3

HDI Build-up

Any Layer, up to 3+N+3

Max Length

1500mm

Board Thickness

0.2~7mm

Min Thickness

2-layer: 0.2mm

4-layer: 0.4mm

6-layer: 0.6mm

8-layer: 0.8mm

10-layer: 1mm

More than 10 layers: 0.5*Layer Count*0.2mm

Copper Thickness

0.5-20oz

Solder Mask Colors

White, Black, Green, Blue, Red, Yellow, Orange, Purple, Matte Green, Matte Black; Carbon Ink

Inks

Super White Inks/Solar/Carbon Inks

Solder Mask Thickness

0.2mil-1.6mil

Solder Mask Dam

4mil

Surface Finishes

Bare Copper, Hasl lead-free, ENIG, ENEPIG, Gold Fingers, OSP, IAg, ISn, etc

Plating Thickness

HASL:

Copper Thickness: 20-35um Tin: 5-20 um

Immersion Gold:

Nickel: 100u"-200u" Gold: 2u" -4u"

Hard Plated Gold:

Nickel: 100u"-200u" Gold: 4u"-8u"

Golden Finger:

Nickel: 100u"-200u" Gold: 5u"-15u"

Immersion Silver: 6u"-12u"

OSP: Film 8u"-20u"

Min Hole Size

0.15mm

Min Trace Width/Spacing

2mil/2mil

Minimum Solder Mask Clearance

2mil

Min Annular Ring

4mil

Min Pad to Pad Clearance

2mil

Via Plugging

0.2~0.8mm

Line Width/Space Tolerance

±10%

Board Thickness Tolerance

±5%

Hole Diameter Tolerance

±0.05mm

Hole Location Tolerance

±2mil

Layer to Layer Registration

2mil

S/M Registration

1mil

Aspect Ratio

10:01

Blind Vias Aspect Ratio

1:01

Outline Tolerance

±0.1mm

V- CUT Tolerance

±10mi

Bevel Edge

± 5mil

Warp and Twist

≤0.50% (max cap)

Quality Test

AOI, 100% E-test

Value-Added Services

DFM Check,Expedited Production

Featured Processes

Bonding, Impedance Control, Via in Pad, Press Fit Hole, Countersink/Counterbore Hole,

Castellated Vias, Edge Plating, Peelable Solder Mask, Resin Plugged, Plating Flat

Data Formats

Gerber, DXF, PCBdoc, ODB++, HPGL, BRD, etc

Multilayer PCB Lamination

ThicknessCopper thick (outer/inner)Layer No.StackUpLaminated chart Thickness
1.6mm±10%1/1ozL1 Copper 18 um--plating to 35um
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 1.2mm with 1/1 oz Cu
L3  
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 Copper 18 um--plating to 35um
1.6mm±10%2/1ozL1 Copper 50um(±5)um-plating to 70um
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 1.2mm with 1/1 oz Cu
L3  
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 Copper 50um(±5)um-plating to 70um
1.6mm±10%2/1.5ozL1 Copper 50um(±5)um-plating to 70um
   
  PP 0.22 mmdielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 1mm with 1.5/1.5 oz Cu
L3  
   
  PP 0.22 mmdielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 Copper 50um(±5)um-plating to 70um
Thickness-testCopper thick (outer/inner)Layer No.StackUpLaminated chart Thickness
1.6mm±10%1/1ozL1 Copper 18 um--plating to 35um
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 1.2mm with 1/1 oz Cu
L3  
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 Copper 18 um--plating to 35um
1.6mm±10%2/1ozL1 Copper 50um(±5)um-plating to 70um
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 1.2mm with 1/1 oz Cu
L3  
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 Copper 50um(±5)um-plating to 70um
1.6mm±10%2/1.5ozL1 Copper 50um(±5)um-plating to 70um
   
  PP 0.22 mmdielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 1mm with 1.5/1.5 oz Cu
L3  
   
  PP 0.22 mmdielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 Copper 50um(±5)um-plating to 70um
ThicknessCopper thick (outer/inner)Layer No.StackUpLaminated chart Thickness
1.6mm±10%1/1ozL1 Copper 18 um--plating to 35um
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 1.2mm with 1/1 oz Cu
L3  
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 Copper 18 um--plating to 35um
1.6mm±10%2/1ozL1 Copper 50um(±5)um-plating to 70um
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 1.2mm with 1/1 oz Cu
L3  
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 Copper 50um(±5)um-plating to 70um
1.6mm±10%2/1.5ozL1 Copper 50um(±5)um-plating to 70um
   
  PP 0.22 mmdielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 1mm with 1.5/1.5 oz Cu
L3  
   
  PP 0.22 mmdielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 Copper 50um(±5)um-plating to 70um
ThicknessCopper thick (outer/inner)Layer No.StackUpLaminated chart Thickness
1.6mm±10%1/1ozL1 Copper 18 um--plating to 35um
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 1.2mm with 1/1 oz Cu
L3  
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 Copper 18 um--plating to 35um
1.6mm±10%2/1ozL1 Copper 50um(±5)um-plating to 70um
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 1.2mm with 1/1 oz Cu
L3  
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 Copper 50um(±5)um-plating to 70um
1.6mm±10%2/1.5ozL1 Copper 50um(±5)um-plating to 70um
   
  PP 0.22 mmdielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 1mm with 1.5/1.5 oz Cu
L3  
   
  PP 0.22 mmdielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 Copper 50um(±5)um-plating to 70um
ThicknessCopper thick (outer/inner)Layer No.StackUpLaminated chart Thickness
1.6mm±10%1/1ozL1 Copper 18 um--plating to 35um
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 1.2mm with 1/1 oz Cu
L3  
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 Copper 18 um--plating to 35um
1.6mm±10%2/1ozL1 Copper 50um(±5)um-plating to 70um
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 1.2mm with 1/1 oz Cu
L3  
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 Copper 50um(±5)um-plating to 70um
1.6mm±10%2/1.5ozL1 Copper 50um(±5)um-plating to 70um
   
  PP 0.22 mmdielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 1mm with 1.5/1.5 oz Cu
L3  
   
  PP 0.22 mmdielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 Copper 50um(±5)um-plating to 70um
ThicknessCopper thick (outer/inner)Layer No.StackUpLaminated chart Thickness
1.6mm±10%1/1ozL1 Copper 18 um--plating to 35um
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 1.2mm with 1/1 oz Cu
L3  
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 Copper 18 um--plating to 35um
1.6mm±10%2/1ozL1 Copper 50um(±5)um-plating to 70um
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 1.2mm with 1/1 oz Cu
L3  
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 Copper 50um(±5)um-plating to 70um
1.6mm±10%2/1.5ozL1 Copper 50um(±5)um-plating to 70um
   
  PP 0.22 mmdielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 1mm with 1.5/1.5 oz Cu
L3  
   
  PP 0.22 mmdielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 Copper 50um(±5)um-plating to 70um
ThicknessCopper thick (outer/inner)Layer No.StackUpLaminated chart Thickness
1.6mm±10%1/1ozL1 Copper 18 um--plating to 35um
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 1.2mm with 1/1 oz Cu
L3  
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 Copper 18 um--plating to 35um
1.6mm±10%2/1ozL1 Copper 50um(±5)um-plating to 70um
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 1.2mm with 1/1 oz Cu
L3  
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 Copper 50um(±5)um-plating to 70um
1.6mm±10%2/1.5ozL1 Copper 50um(±5)um-plating to 70um
   
  PP 0.22 mmdielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 1mm with 1.5/1.5 oz Cu
L3  
   
  PP 0.22 mmdielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 Copper 50um(±5)um-plating to 70um
ThicknessCopper thick (outer/inner)Layer No.StackUpLaminated chart Thickness
1.6mm±10%1/1ozL1 Copper 18 um--plating to 35um
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 1.2mm with 1/1 oz Cu
L3  
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 Copper 18 um--plating to 35um
1.6mm±10%2/1ozL1 Copper 50um(±5)um-plating to 70um
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 1.2mm with 1/1 oz Cu
L3  
   
  PP 0.11 mm(2116) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 Copper 50um(±5)um-plating to 70um
1.6mm±10%2/1.5ozL1 Copper 50um(±5)um-plating to 70um
   
  PP 0.22 mmdielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 1mm with 1.5/1.5 oz Cu
L3  
   
  PP 0.22 mmdielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 Copper 50um(±5)um-plating to 70um
ThicknessCopper thick (outer/inner)Layer No.StackUpLaminated chart Thickness
1.0mm±0.1mm1/1ozL1 Copper 18 um--plating to 35um
   
  PP 0.08 mm(1080) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 0.2mm with 1/1 oz Cu
L3  
   
  PP 0.08 mm(1080) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 
  Core 0.2mm with 1/1 oz Cu
L5 
   
  PP 0.08 mm(1080) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L6  
  Core 0.2mm with 1/1 oz Cu
L7  
   
  PP 0.08 mm(1080) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L8 Copper 18 um--plating to 35um
ThicknessCopper thick (outer/inner)Layer No.StackUpLaminated chart Thickness
1.0mm±0.1mm1/1ozL1 Copper 18 um--plating to 35um
   
  PP 0.08 mm(1080) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 0.2mm with 1/1 oz Cu
L3  
   
  PP 0.08 mm(1080) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 
  Core 0.2mm with 1/1 oz Cu
L5 
   
  PP 0.08 mm(1080) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L6  
  Core 0.2mm with 1/1 oz Cu
L7  
   
  PP 0.08 mm(1080) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L8 Copper 18 um--plating to 35um
ThicknessCopper thick (outer/inner)Layer No.StackUpLaminated chart Thickness
1.0mm±0.1mm1/1ozL1 Copper 18 um--plating to 35um
   
  PP 0.08 mm(1080) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 0.2mm with 1/1 oz Cu
L3  
   
  PP 0.08 mm(1080) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 
  Core 0.2mm with 1/1 oz Cu
L5 
   
  PP 0.08 mm(1080) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L6  
  Core 0.2mm with 1/1 oz Cu
L7  
   
  PP 0.08 mm(1080) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L8 Copper 18 um--plating to 35um
ThicknessCopper thick (outer/inner)Layer No.StackUpLaminated chart Thickness
1.0mm±0.1mm1/1ozL1 Copper 18 um--plating to 35um
   
  PP 0.08 mm(1080) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 0.2mm with 1/1 oz Cu
L3  
   
  PP 0.08 mm(1080) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 
  Core 0.2mm with 1/1 oz Cu
L5 
   
  PP 0.08 mm(1080) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L6  
  Core 0.2mm with 1/1 oz Cu
L7  
   
  PP 0.08 mm(1080) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L8 Copper 18 um--plating to 35um
ThicknessCopper thick (outer/inner)Layer No.StackUpLaminated chart Thickness
1.0mm±0.1mm1/1ozL1 Copper 18 um--plating to 35um
   
  PP 0.08 mm(1080) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L2  
  Core 0.2mm with 1/1 oz Cu
L3  
   
  PP 0.08 mm(1080) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L4 
  Core 0.2mm with 1/1 oz Cu
L5 
   
  PP 0.08 mm(1080) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L6  
  Core 0.2mm with 1/1 oz Cu
L7  
   
  PP 0.08 mm(1080) dielectric constant 4.29 ± (The DK value is not absolute and will vary depending on the base material's models and thickness.)
   
L8 Copper 18 um--plating to 35um

PRODUCTS SHOWCASE

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FEATURED PROCESS

  • Tenting Vias

    It means that the vias are simply covered by solder mask ink. No additional process steps are required during fabrication.
  • Plugged Vias

    For better BGA soldering, plugin the vias with inks or resin to prevent solder paste flow down into the vias.
  • Edge-plating

    Metalization of the board edge, for improving EMC performance, cooling, housing connection, Board-on-Board connection, or others.
  • Castellated Vias

    Castellated vias are holes that are made off the edge of the boards plated with copper, mainly used for board-on-board connections.
  • Slots

    Remove the area of a PCB specified by the design file to form a specific shape, it can be plated or non-plated, through slot or in-depth slot.
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