What is High-Tg PCB?
The Glass Transition Temperature Level (Tg) is one of the most essential buildings of any type of epoxy and is the temperature level area where the polymer shifts from tough, glazed material to a soft, rubbery material.
Common PCB materials at heats, not only will be softened, deformation, melting as well as various other phenomena, but also the mechanical, as well as electric residential and properties, decrease greatly. PCBs with high TG can greatly improve the heat resistance and processability of boards and products.
Low Tg is 130℃-140℃ centigrade, moderate Tg is above 150℃-160℃ centigrade, High-Tg is above 170℃. Customarily, PCBs made with Tg ≥ 170℃ FR4 material are called high Tg printed circuit boards. With the fast development of the electronic devices market, high Tg PCBs are extensively used in computers, interaction tools, exact apparatus, as well as instruments, and so on.
High-TG PCB Materials
|Material||TG (DSC, °C)||Td (Wt, °C)||CTE-Z (ppm/°C)||Td260 (min)||Td288 (min)|
High-TG PCB Capabilities
|Material||FR4 (140Tg, 170Tg, 180Tg), FR-406, FR-408, 370HR, IT180A, Polyimide, Rogers 4350B/3003/4003C/5880, Taconic, Teflon, etc|
|Material Brands||KB, ITEQ, SY, ISOLA, Rogers (Arlon), Ventec, Laird, Nelco, Taconic, or other laminate on customer's request|
|Quality Standards||IPC Classes 2/3|
|HDI Build-up||Any Layer, up to 3+N+3|
More than 10 layers: 0.5*Layer Count*0.2mm
|Solder Mask||White, Black, Green, Blue, Red, Yellow, Orange, Purple, Matte Green, Matte Black; Carbon Ink|
|Solder Mask Thickness||0.2mil-1.6mil|
|Solder Mask Dam|
|Surface Finishes||Bare Copper, Hasl lead-free, ENIG, ENEPIG, Gold Fingers, OSP, IAg, ISn, etc|
Copper Thickness: 20-35um Tin: 5-20 um
Nickel: 100u"-200u" Gold: 2u" -4u"
Hard Plated Gold:
PNickel: 100u"-200u" Gold: 4u"-8u"
Nickel: 100u"-200u" Gold: 5u"-15u"
Immersion Silver: 6u"-12u"
OSP: Film 8u"-20u"
|Min Hole Size||0.15mm|
|Min Trace Width/Spacing||2mil/2mil|
|Minimum Solder Mask Clearance||2mil|
|Min Annular Ring||4mil|
|Min Pad to Pad Clearance||2mil|
|Line Width/Space Tolerance||±10%|
|Board Thickness Tolerance||±5%|
|Hole Diameter Tolerance||±0.05mm|
|Hole Location Tolerance||±2mil|
|Layer to Layer Registration||2mil|
|Blind Vias Aspect Ratio||1:01:00|
|V- CUT Tolerance||±10mi|
|Bevel Edge||± 5mil|
|Warp and Twist||≤0.50% (max cap)|
|Quality Test||AOI, 100% E-test|
|Value-Added Services||DFM Check,Expedited Production|
|Featured Processes||Bonding, Impedance Control, Via in Pad, Press Fit Hole, Countersink/Counterbore Hole, Castellated Vias, Edge Plating, Peelable Solder Mask, Resin Plugged, Plating Flat|
|Data Formats||Gerber, DXF, PCBdoc, ODB++, HPGL, BRD, etc|